| Customization: | Available |
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| Condition: | New and Used |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
Precision 3D SP for second process of semiconductor manufacturing
In-Line SPI Machine
- High Speed Precision In-Line SPI System
- Exclusive TWENTY-FIVE MEGA PIXEL ISIS® Vision System
- 7.7 Micron / Pixel Precision TELECENTRIC COMPOUND LENS Design
- Advanced Dual Projection SHADOW FREE MOIRÉ Design
- 2 Micron Height Accuracy
- Precision LINEAR DRIVE Motor System
- Extremely Simple Programming and Operation
Feature:
| PCB Inspection Area | |||
| MS-15 | 50 mm x50 mm to 510 mm x460 mm (2.0"x2.0"to 20.1"x18.1") | ||
| PCB Indexing Mode:50 mm x50 mm to 1,020 mm x460 mm (2.0"×2.0"to 40.16"x18.1") | |||
| MS-15U | 60 mm x60 mm to 660 mm x610 mm (2.36"x2.36"to 26.0"x24.1") | ||
| PCB Indexing Mode:60 mm x60 mm to 1,320 mm x610 mm (2.36"×2.36"to 51.97"×24.1") | |||
| MS-15DL (Dual Lane) | Single Lane:50 mm x50 mm to 460 mm x590 mm (2.0"×2.0"to 20.1"x23.23")/ Dual Lane:50 mm x50 mm to 460 mm x300 mm (2.0"×2.0"to 20.1"x11.81") |
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| Vision System (FOV Size) | |||
| 15MP CoaXPress:(3,904×3,904 @120 fps) | Option 1 | Pixel Resolution:15um | 58.56 mm x58.56 mm (2.31"×2.31") |
| Option 2 | Pixel Resolution:10um | 39.04 mm x39.04 mm(1.54"×1.54") | |
| 25MP CoaXPress:(5,120×5,120 @72 fps) | Option 1 | Pixel Resolution:7.7um | 39.42 mm x39.42 mm(1.55"x1.55") |
| Inspection Technology | |||
| 3D Inspection Technology | Dual Projection Shadow Free Moiré Phase Step Image Processing | ||
| 2D Inspection Technology | 15MP CoaXPress /25MP CoaXPress Camera System | ||
| Height Resolution | ±1um | ||
| Height Accuracy on Calibration Fixture | ±1% | ||
| Repeatability on Calibration Fixture | Height:±1%/Volume:±2% | ||
| Inspection Height | Maximum:500 um /Minimum:40um | ||
| 3D Inspection Item | Solder Deposition:Height,Volume,Area,Solder Bridge,X/Y Offset,Shape Deformity,etc. | ||
| Additional Specifications | |||
| Lens Configuration | Precision Telecentric Compound Lens Design | ||
| Lighting System | Advanced High-Intensity RGB LED Lighting System. | ||
| PCB Surface Clearance | Top-Side Clearance:20 mm /Bottom-Side Clearance:50 mm | ||
| PCB Edge Clearance | Top-Edge Clearance:3 mm /Bottom-Edge Clearance:3.5 mm | ||
| Maximum PCB Warpage | ±2 mm | ||
| Maximum PCB Weight | Standard:4 Kg(8.82 Lbs.) | ||
| PCB Thickness Range | Standard:0.5mm-5mm | ||
| Robot Positioning System | Precision Linear Drive System,Resolution:0.2um /Repeatability:±2um | ||
| Power Requirements | Single Phase 200~240V 50~60Hz;1.1KW,Breaker Capacity:25Amp | ||
| Air Requirements | 5 Kgf /cm²(0.5 Mpa);(71 PSI) | ||
| Machine Dimensions and Weight | |||
| MS-15 | 1,250 mm Lx1,500 mm Dx1,600 mm H (49.21"x59.06"x62.99") | 1,200 Kg (2,645.55lbs.) | |
| MS-15U | 1,400 mm Lx1,650 mm Dx1,600 mm H (55.2"x64.96"x62.99") | 1,500 Kg (3,306.93lbs.) | |
| MS-15DL | 1,250 mm Lx1,500 mm Dx1,600 mm H (49.21"x59.06"x62.99") | 1,400 Kg (3,086.47lbs.) | |
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