| Customization: | Available |
|---|---|
| Condition: | New |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
The new 3Di series of high-speed, high-precision, next-generation in-line 3D automated optical inspection (3D AOI) systems for complex inspection of high-density printed circuit boards and boards with a combination of very small and tall components. The new 3Di series is equipped with a newly developed camera system that significantly reduces cycle and produces ultra-sharp high-resolution 3D images thanks to its ability to simultaneously and accurately inspect both extremely small parts, such as 008004s (0201 metric), and tall parts at the same time. This latest automated inspection solution from Saki contributes to enhanced quality assurance and increased productivity and is perfect for highest quality inspection of ever-evolving high-density PCB technology.
1: Advanced Hardware Features
Proprietary Hardware provides accurate measurements Saki's machines are built with hardware that's made to last.A closed-loop, dual servo motor drive system, high-resolution linear scale, and rigid gantry structure provide unsurpassed accuracy and repeatability for absolute measurements.An optimized conveyor system, driven by step motors, enables fast PCBA loading and unloading.
Self-diagnostic System
Saki's predictive and preventive maintenance management system assures stable machine conditions and repeatable, consistent performance. Every key component is monitored along with system conditions, and a detailed diagnostic log is recorded. The optimized preventive maintenance plan reduces maintenance time, machine down-time, manpower, and costs.
Optical Unit
Four, multi-frequency digital projectors provide accurate 3D measurements for high-quality images.Three camera resolution levels - 7µm, 12µm, and 18µm - are available to match application requirements.Saki's CoaXPress interface in the overhead camera captures images 1.7 times faster than previous models.Enhanced 2D and 3D calibration uses multiple calibration height targets for positive and negative heights to guarantee height measurement accuracy.
Side Cameras*
A quad side camera system ensures inspection of the entire board, including dead angles and areas missed by overhead cameras. *factory-installed option
2: Advanced Software Features
Programming
Special BF2 software has a common user-interface for Saki's 3D SPI, AOI, and AXI systems.
The software saves a full 3D image of the whole PCBA, so the operator can create inspection data without using the physical board.
Saki's Easy Programming Function was developed on the concepts of Board less, Skill less, and Stress less. Detailed component libraries can be automatically created using Saki's database and BOM data.
Inspection Data per IPC Standards
Default thresholds of inspection data conform to IPC standards.
Measurement inspection and tuning function
Offline Debugging: Operator can edit inspection data to check previous Good/NG images, or real-time defect images, offline without any production interruptions.
Warpage Adjustment: Warpage is compensated automatically. An accurate height map is made of the entire PCBA surface, enabling the Extra Component Detection function to detect foreign material.
Fujiyama (Through-hole device Solder Inspection):
The Fujiyama algorithmprovides complete through-hole joint inspection in a single step.It simultaneously inspects for copper exposure, pin detection, pin-holes, solder fillets, and bridges.
Inspection Data Verification
History Management System: The History Management System records the detailed data modification system in detail (who, what, when, where, why, and how).
"Golden-Silver Board Function" Maintains inspection accuracy by checking machine status and inspection conditions before starting auto operation.
3: Applied Technology
Machine-to-Machine (M2M) Solution
1.Feed-back from SPI to Screen Printer. Feeds back misalignment data and prevents print errors by automatically alerting the user when the stencil needs cleaning.
2.Feed-forward from SPI to Pick-and-Place machine. Measures the degree the printing position shifts to correct placement positioning. A NG board skip function improves efficiency, quality, and cost.
3.Feed-back from AOI to Pick-and-Place machine. Feeds backplacement position and location data from AOI to pick-and-place and feeds forward data from SPI to improve quality and efficiency.
4.Automated line control function. Automates control of the assembly line to reduce rework and waste and increase throughput.
* For items 1-4 above, Saki partners with the leading PCB equipment manufacturers. Ask us which products we connect with.
Options
BF2-Editor
Create data and debug the process offline.
BF2-Monitor (Offline verification terminal)
RMS (Remote Management System). Remotely control multiple BF2-Monitors with a single PC. Reduces assembly-floor personnel. Moreover, the production status of each device can be confirmed.
MPV (Multi Process View). The BF2-Monitor shows the results of all inspection processes (SPI, pre-reflow, and post reflow) on one screen in real time for operator review, simplifying the verification process and making it less subject to error. It is also useful for analyzing the cause of a defective board.
3Di Series Product Specifications
Dual-lane system can inspect 2 different PCBAs simultaneously
Feature:
| Market | Asia | Global | |||||
| Dimensions |
M
Single lane
|
M
Dual lane
|
L
Single lane
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L
Dual lane
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XL
Single lane
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| Model Name | 3Di-MS2 | 3Di-MD2 | 3Di-LS2 | 3Di-LD2 | 3Di-ZS2 | ||
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Size (W)×(D)×(H)
(mm,in.)
|
850×1430×1500,
33.46×56.30×59.06
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1040×1440×1500,
40.94×56.69×59.06
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1340×1440×1500
52.75×56.69×59.06
|
||||
| Weight | 850kg,1873.93Ib | 900kg,1984.16lb | |||||
| Electric Power | Single Phase~200-240V+/-10%,50/60Hz | ||||||
| Air Requirement | 0.5MPa,5L/min(ANR) | ||||||
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PCB Size
(mm,in.)
|
Single
mode
|
Dual
mode
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Single
mode
|
Dual
mode
|
|||
|
50×60~330×330,
1.97×2.36~12.99×12.99
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50×60~330×330,
1.97×2.36~12.99×12.99
|
50×60~320×330,
1.97×2.36~12.60×12.99
|
7μm camera head | 7μm camera head |
50×60~686×870,
1.97×2.36~27.00×34.25
|
||
|
50×60~330×330,
1.97×2.36~12.99×12.99
|
50×60~330×330,
1.97×2.36~12.99×12.99
|
50×60~320×330,
1.97×2.36~12.60×12.99
|
|||||
| 12/18μm camera head | 12/18μm camera head | ||||||
|
50×60~500×510,
1.97×2.36~19.68×20.07
|
50×60~500×510,
1.97×2.36~19.68×20.07
|
50×60~320×510,
1.97×2.36~12.60×20.07
|
|||||
| PCB Clearance |
Top:40mm,1.57in.
Bottom:60mm,2.36in.
|
Top:40mm,1.57in.
Bottom:50mm,1.96in.
|
Top:40mm,1.57in.
Bottom:60mm,2.36in.
|
Top:40mm,1.57in.
Bottom:50mm,1.96in.
|
Top:40mm,1.57in.
Bottom:60mm,2.36in.
|
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