| Customization: | Available |
|---|---|
| After-sales Service: | Panasonic Modular Chip Mounter Npm-W2 |
| Condition: | New and Used |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
Panasonic NPM-W2(NPM-D2) SMT Pick And Place Machine
The NPM-W2 combines accurate component placement, precise SPI and AOI inspection and reproductive adhesive dispensing in one high-speed solution.
Also available as a single-beam platform NPM-W2S.
Higher productivity and quality with printing, placement and inspection process integration
1.For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm
2.Higher area productivity through dual lane placement
3.Quick-change feeder carts and nozzle banks
4.Lightweight 16-nozzle head (for 77,000 CPH) with increased placement accuracy to 25um (cpk ≥ 1.0)
This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.
In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used.
Features
The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted.
Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.
As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.
This platform is also available as a single-beam solution:
| Model | NPM-W2(NPM-D2) | ||||||||||||
| Front head/Rear head | Lightweight 16-nozzle head | 12-nozzle head | Lightweight 8-nozzle head | 3-nozzle head V2 | Dispensing head | No head | |||||||
| Lightweight 16-nozzle head | NM-EJM7D | NM-EJM7D-MD | NM-EJM7D | ||||||||||
| 12-nozzle head | |||||||||||||
| Lightweight 8-nozzle head | |||||||||||||
| 3-nozzle head V2 | |||||||||||||
| Dispensing head | NM-EJM7D-MD | _ | NM-EJM7D-D | ||||||||||
| Inspection head | NM-EJM7D-MA | NM-EJM7D-A | |||||||||||
| No head | NM-EJM7D | NM-EJM7D-D | _ | ||||||||||
| PCB dimensions | Single-lane *1 | Batchmounting | L50mm×W50mm~L750mm×W550mm | 2-positin mounting | L50mm×W50mm~L350mm×W550 mm | ||||||||
| Dual-lane*1 | Dualtransfer(Batch) | L50mm×W50mm~L750mm×W260mm | Dualtransfer (2-positin) |
L50mm×W50mm~L350mm×W260 mm | |||||||||
| Singletransfer (Batch) |
L50mm×W50mm~L750mm×W510mm | Singletransfer (2-positin) |
L50mm×W50mm~L350mm×W510 mm | ||||||||||
| Electric source | 3-phase AC 200,220,380,400,420,480 V 2.8 kVA | ||||||||||||
| Pneumatic source *2 | 0.5 MPa,200 L/min(A.N.R.) | ||||||||||||
| Dimensions *2 | W1280mm*3×D2332mm*4×H1444mm*5 | ||||||||||||
| Mass | 2470 kg (Only for main body:This differs depending on the option confguration.) | ||||||||||||
| Placement head | Lightweight16-nozzle head(Per head) | 12-nozzle head(Per head) |
Lightweight 8-nozzle head
(Per head)
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3-nozzle head V2
(Per head)
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| High production mode[ON] | High production mode[OFF] | High production mode[ON]High production mode[OFF] | |||||||||||
| Max.speed | 38500cph (0.094s/chip) | 35000cph(0.103 s/chip) | 32250cph(0.112s/chip) | 31250cph(0.115s/chip) | 20800cph (0.173 s/chip) |
8320 cph (0.433 s/chip)
6500 cph (0.554s/QFP
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| Placement accuracy(Cpk≥1) | ±40μm/chip |
±30μm /chip
(±25μm/chip*6)
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±40 μm/chip | ±30μm/chip |
±30μm/chip
±30μm/QFF012 mm~032 mm
±50μm/QFP012mmUnder
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±30μm/QFP | |||||||
| Component dimensions(mm) |
0402*7 chip
~L6×W6×T3~L6×W6×T3
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03015*7*8/0402*7 chip | 0402*7chip~L12×W12×T6.5 |
0402*7 chip
~L32×W 32×T12
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0603 chip to
L150×W25(diagonal152)×T30
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Component
supply
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Taping | Tape:4/8/12/16/24/32/44/56mm | Tape:4 to 56 mm | Tape:4 to 56/72/88/104m | |||||||||
| Max.120(Tape:4,8 mm) |
Front/rear feeder cart specifications:Max.120 (Tape width andfederaresubect totheconditions on thelet)
Single tray specifications:Max.86 (Tape with andfederae subectotheconifionson theleft
Twin tray specifcations :Max.60(Tape with andfederae subectotheconifionson theleft
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| Stick | _ |
Front/rear feedercart specifcations:Max.30(Single stick feeder)
Single tray specifications :Max.21(Single stick feeder)
Twin tray specifications :Max.15(Single stick feeder)
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| Tray | _ |
Single tray specifcations :Max.20
Twin tray specifications:Max.40
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| Dispensing head | Dot dispensing | Draw dispensing | |||||||||||
| Dispensing speed | 0.16 s/dot (Condition:XY=10 mm,Z=less than 4 mm movement,Noθ rotation) | 4.25 s/component (Condition:30 mm x30 mm corner dispensing)*9 | |||||||||||
| Adhesive position acuracy(Cpk≥1) | ±75μm/dot | ±100μm/component | |||||||||||
| Applicable components | 1608chip to SOP,PLCC,QFP,Connector,BGA,CSP | BGA,CSP | |||||||||||
| Inspection head | 2D inspection head(A) | 2D inspection head(B) | |||||||||||
| Resolution | 18μm | 9μm | |||||||||||
| View size | 44.4 mm×37.2 mm | 21.1mm ×17.6mm | |||||||||||
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Inspection
processing
time
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Solder Inspection*10 | 0.35 s/View size | |||||||||||
| Component Inspection*10 | 0.5 s/View size | ||||||||||||
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Inspection
object
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Solder
Inspection *10
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Chip component:100 μm×150 μm or more(0603 or more)
Package component:φ150 μm or more
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Chip component:80 μm×120 μm or more(0402 or more)
Package component:φ120 μm or more
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Component
Inspection*10
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Square chip(0603 or more),SOP,QFP(a pitch of 0.4 mm or more)
CSP,BGA,Aluminum electrolysis capacitor,Volume,Trimmer ,Coil ,Connector*11
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Square chip(0402 or more),SOP,QFP(a pitch of 0.3 mm or more)
CSP,BGA,Aluminum electrolysis capacitor,Volume ,Trimmer,Coil ,Connector*1
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Inspection
items
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Solder Inspection*10 | Oozing ,blur ,misalignment ,abnormal shape,bridging | |||||||||||
| Component Inspection*10 | Missing ,shift,fipping,polarity ,foreign object inspection*2 | ||||||||||||
| Inspection position accuracy(Cpk≥1)*13 | ±s20 μm | ±10 μm | |||||||||||
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No.of
inspection
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Solder Inspection*10 | Max.30000 pcs./machine(No.of components :Max.10000 pcs./machine) | |||||||||||
| Component Inspection*10 | Max.10000 pcs./machine | ||||||||||||
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