| Customization: | Available |
|---|---|
| Condition: | New |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
Dek E by DEK SMT Solder Paste Printer
E by DEK, an innovative platform with high-quality components, sophisticated construction, and modular design that guarantees a stable and reliable printing process even for the latest fine-pitch applications. With the shortest cycle times and the fastest product changeovers paired with maximum repeat accuracy, the E by DEK sets new standards in the mid-speed segment.
Features
Paste-on-pad verification with the DEK paste roll height monitor
Flexibility with a semi-automatic stencil load, edge clamps, and multi-speed conveyor
Printing over oversized boards - up to 620mm adaptable with the E-Solutions with integrated software solutions for instant line monitoring and traceability
8 seconds core cycle time
Sophisticated construction
Modular design
Fast set up changeovers
Transport and prints boards with lengths of up to 620 milometers
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Model |
Dek E by DEK |
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Alignment |
> 2.0 Cmk @ ± 12.5 μm (± 6 sigma) |
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System alignment capability |
> 2.0 Cmk @ ± 25 μm (± 6 sigma) |
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Optimum core cycle time |
8 seconds |
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Substrate size |
50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) |
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Operating System |
Windows 7 Embedded |
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Squeegee pressure mechanism |
Software-controlled, motorised with closed loop feedback |
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Stencil positioning |
Semi-auto stencil load with drip tray |
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Under stencil cleaning |
Interchangeable under stencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe |
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Adjustable-width stencil mount (AWSM) |
Frame variants - fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm |
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Substrate thickness |
0.2 mm to 6 mm |
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Substrate weight (maximum) |
6 kg |
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Substrate warpage |
Up to 7 mm including substrate thickness |
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Substrate fixture |
Over the top clamps Edge clamps Foil-less clamps Vacuum |
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Temperature & humidity sensor |
Monitoring of the process environment |
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