| Customization: | Available |
|---|---|
| Condition: | New |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
DESEN DGL-E SMT Solder Paste Printer
DESEN SMT Stencil printer is high accuracy and high stability of the fully automatic printing machine vision,Desen followed in SMT industry is the development trend of production of a new generation of fully automatic printing machine with the international leading technology synchronous vision, visual processing of high resolution, high precision of the transmission system, suspension adaptive scraper.
Features
The whole machine is fully controlled by servo system;
Automatic pressure feedback system;
Multifunctional image processing system;
Precise PCB transportation system;
Intelligent PCB holding device;
Automatic steel mesh positioning module;
Automatic and effective steel mesh cleaning system;
User-friendly operation interface;
| Process Parameters | Specification |
| Printing Accuracy | ±30μm@6σ,Cpk≥2.0 Verified by the test system CeTaQ |
| Repeat Position Accuracy | ±15μm@6σ,Cpk≥2.0 Verified by the test system CeTaQ |
| Cycle Time | 12s |
| Screen Frame Size | 737mmx300mm~1800mmx737mm |
| Screen Frame Thickness | 20mm-40mm |
| Substrate Size(minimum) | 80mm(X)×50mm(Y) |
| Substrate Size(maximum) | 1500mm(X)×510mm(Y) |
| Substrate Thickness | 0.4mm-6mm |
| Print Pressure | Okg-20kg |
| Print Speed | 6mm/sec-120mm/sec |
| Print Gap | 0mm-20mm |
| Substrate Separation | Speed:0.1-20mm/s |
| Distance:0mm-30mm | |
| Apply Paste Option | Solder paste,printing ink,silver paste |
| Transportation System | Specification |
| Substrate Weight(maximum) | ≤15kg |
| Transport Speed | Segmented control,1200mm/s(Max) |
| Board Height | ≤10mm(Customizable) |
| Transport Height | 900±40mm |
| Electrical Configuration& Environmental Requirement |
Specification |
| Voltage | 220Volts +/-10%.Single phase 50/60Hz |
| Power | 3kw |
| Air Supply | 4.5-6kgf/cm² |
| Temperature | -20ºC~+45ºC |
| Humidity | 30%-70%relative humidity |
| Standard Configuration | Specification |
| Automatic Platform Calibration System | The platform height is automatically calibrated according to the thickness ofthe substrate. |
| Substrate Support Positioning System | Flexible side clamp,Support block ,Manual clamp |
| Intelligent Transportation System | The automatic stopping device+automatic substrate positioning +left in left out, left in right out,right in right out,right in left out. |
| Stencil Bottom Cleaning | Drop cleaning,largest size 510mm |
| Handing &Cleaning Options | Wet cleaning +dry cleaning(free combination) |
| Approximate Dimension | 2600(L)X1405(W)X1565(H)mm |
| Approximate Weight | 2000kg packaged(depend upon configured options selected with machine) |
| 1800kg unpackaged(depend upon configured options selected with machine) |
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