| Customization: | Available |
|---|---|
| Condition: | New and Used |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
The Mirtec MV-6 OMNI series delivers exceptional 2D and full 3D inline optical inspection with unmatched efficiency, speed, and accuracy-at an affordable price point.
The MV-6 OMNI utilizes patented Blue DLP Moiré technology for precise, noise-free 3D measurements, even on reflective surfaces. Its 15 MP camera and 10 or 15 μm telecentric lens ensure lightning-fast, high-resolution inspection. Combining 3D and full 2D measurement capabilities, it detects defects that standalone 3D systems might miss, such as polarity marks, cracks, and solder imperfections. With its 8-phase illumination system, including coaxial lighting, even the finest details are flawlessly captured.
The system's side camera adds another layer of precision, enabling inspection at angles perfect for detecting issues like solder joints on J-leg ICs, QFNs, and polarity marks.
Feature:
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Model: |
MV-6E (OMNI) |
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PCB size: |
50mm×50mm~480mm×460mm |
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High accuracy: |
±3um |
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Max component height: |
5mm |
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2D inspection items: |
Missing parts, offset, skewed, tombstone, side-standing, overturned parts, polar opposites, wrong parts, damaged, soldered joints, false soldering, voids, OCR |
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3D inspection items: |
Missing parts, height, position, more tin, less tin, missing solder, double chip, size, IC pin soldering, foreign matter, lifted parts, BGA lifted, tin crawling detection, etc. |
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FOV field of view: |
58.56mm×58.56mm |
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3D detection speed: |
0.80 s/FOV/4.260mm²/s |
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2D detection speed: |
0.30 s/FOV/10, 716mm²/s |
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Lens: |
Precise Telecentric Compound Lenses |
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Lighting system: |
8-segment color lighting system |
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SPC: |
Complete statistical software |
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PCB clearance: |
45mm |
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PCB thickness: |
0.5~5mm |
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Mini. measurement size: |
03015 |
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GPS: |
Servo motor |
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Repeatability: |
±10um |
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3D detection technology: |
DVLP 8 groups of moiré stripe technology |
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Physical dimension(mm): |
1080(W)×1470(D)1560(H) |
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Weight: |
950KG |
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Gas source: |
5KGf/cm²(0.5Mpa) |
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Power supply: |
200-240VAC 50Hz/60Hz |
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