| Customization: | Available |
|---|---|
| Condition: | New and Used |
| Speed: | High Speed |
|
Still deciding? Get samples of US$ 35000/Piece
Request Sample
|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
The MV-3 Series offers Advanced Five Mega Pixel Digital Color Camera Technology in a desktop AOI system. This advanced technology provides the ultimate in inspection
performance and speed. The optional Side Viewer® camera system provides enhanced inspection capability through the addition of four Five Mega Pixel Side View Digital Color Cameras.
MIRTEC's MV-3 Series is the world's first generation of five camera Desktop AOI systems.
Feature:
| MODEL | MV-3L | MV-3U | ||
| Machine Dimensions | 975(W)x1200(D)x595 mm(H) | 1185(W)x1455(D)x610 mm (H) | ||
| Inspection Area | 50x50~450x400 mm | 50x50~660x510 mm | ||
| Weight | 110 Kg | 160 Kg | ||
| FOV/Resolution | 2.0 Mega Pixel Camera System | Option 1 | FOV.29.1×21.8 mm,Resolution:18.2 μm/pixel | |
| Option 2 | FOV:21.5×16.1 mm,Resolution:13.4 μm/pixel | |||
| Option 3 | FOV:15.7×11.8 mm,Resolution:9.8 μm/pixel | |||
| 5.0 Mega Pixel Camera System | Option 1 | FOV.44,7×37,4 mm,Resolution:18.2 μm/pixel | ||
| Option 2 | FOV.32,9×27,5 mm,Resolution:13.4 μm/pixel | |||
| Option 3 | FOV:24,0×20,1 mm,Resolution:9.8 μm/pixel | |||
| Inspection Speed |
2.0 Mega Pixel Camera System | Option 1 | 29 cm²/sec. (0,22 sec/frame) | |
| Option 2 | 16 cm²/sec. (0,22 secframe) | |||
| Option 3 | 8 cm²/sec. (0,22 sec/frame) | |||
| 5.0 Mega Pixel Camera System | Option 1 | 60 cm²/sec. (0,28 sec./frame) | ||
| Option 2 | 32 cm²/sec. (0,28 sec/frame) | |||
| Option 3 | 17 cm²/sec. (0,28 sec/frame) | |||
| Smallest Component Inspection | Option 1 | 0,4 pitch IC,0201 Chip | ||
| Option 2 | 0,3 pitch IC,01005 Chip | |||
| Option 3 | 0,3 pitch IC,01005 Chip | |||
| Inspection Item | Lifted Lead, Lifted Components, Bridge, Wrong Component, Excessvie Solder, Insufficient Solder, Open Solder, Missing Component, Misalignment, Skew Component, Polarity,Tombstone, Flipped Components,Incorrect Component (OCR Recognition), Pad Scratch,Solder Balls, Lifted Components under QFP/BGA Package (laser Option) | |||
| Options | Side Viewer®, NG Marker(Mechanic), Barcode, OLTT, INTELLISYS® (Remote SPC, Remote Repair, Remote Management), 1D or 2D Guntype Barcode Reader |
|||
| Top Down Camera | 2.0 Mega (1600×1200 Pixels) | |||
| 5.0 Mega (2456×2058 Pixels) | ||||
| Side Viewer Camera | SideViewerB:2.0 Mega (1600x1200 Pixels)/4 set | |||
| SideViewerB:5.0 Mega(2,592x1,944 Pixels)/4 set | ||||
| Lighting System | 3 Layer LED (Horizontal,Vertical,Coaxial),Quad Angle Lighting System,User defined settings |
|||
| 3D-Beam Laser Resolution/accuracy | Z-Height Repeating Measurement Accuracy:±20 μm(Resolution:15 μm/point) | |||
| PC | IntelR CoreTM 2 Duo,19"LCD Monitor,Windows XP Professional | |||
| Power Requirements | Single Phase AC 85~264V,50/60Hz | |||
| Environment | Temperature:10-40°C.,Humidity:30-80%RH | |||
| Remark 1)Clearance between PCB surface and Robot is 25mm in common (45mm is optional) 2)With 45mm Clearance option,Side Viewer8option is not applicable. 3)Either 3D-BeamQ Laser system or NG-marker is only applicable as an option. |
||||
){kind=link}