| Customization: | Available |
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| Condition: | New and Used |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
MIRTEC's all new MV-7 Series 2D/3D AOI Systems may be configured with a stateof-the-art 15 Mega Pixel top-down camera system which we affectionately refer to as ISIS. This is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of inspection equipment. ISIS is an acronym for Infinitely Scalable Imaging Sensor. As the name implies the ISIS Vision System may be scaled or modified to address the specific inspection requirements of virtually any production environment without sacrificing speed or performance. By changing the magnification of the Precision Telecentric Lens the resolution of optics system may be scaled from 20 microns/pixel with an incredibly large FOV of (77.7mm x 77.7mm) desired for extremely high speed manufacturing; down to 10 microns/pixel with an FOV of approximately (38.8mm x38.8mm) which is suitable for high end micro-electronics manufacturing.MIRTEC's revolutionary 3D Multi Frequency Quad Moiré Technology, provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Moiré Inspection Probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-7 machines will also feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology will, undoubtedly, set the standard by which all other inspection equipment will be measured.
Feature:
| PCB Inspection Area | |||
| MV-7 OMNI | 50 mm x50 mm to 510 mm x460 mm (2.0"x2.0"to 20.1"x18.1") | ||
| PCB Indexing Mode:50 mm x50 mm to 1,020 mm x460 mm (2.0"×2.0"to 40.16"×18.1") | |||
| MV-7U OMNI | 60 mm x60 mm to 660 mm x610 mm (2.36"×2.36"to 26.0"×24.1") | ||
| PCB Indexing Mode:60 mm x60 mm to 1,320 mm x610 mm (2.36"×2.36"to 51.97"×24.1") | |||
| Vision System (FOV Size) | |||
| 15MP CoaXPress:(3,904x3,904 @120 fps) |
Option 1 | Pixel Resolution:15 um | 58.56 mm x58.56 mm (2.31"×2.31") |
| Option 2 | Pixel Resolution:10 um | 39.04 mm x39.04 mm(1.54"x1.54") | |
| 25MP CoaXPress:(5,120×5,120 @72 fps) | Option 1 | Pixel Resolution:7.7 um | 39.42 mm x39.42 mm(1.55"x1.55") |
| OMNI-VISIONO Inspection Technology | |||
| 3D Inspection Technology | Digital Tri-Frequency Moiré Technology-12 Projection Blue DLP | ||
| 2D Inspection Technology | 15MP125MP CoaXPress Camera System | ||
| Maximum 3D Inspection Height | 25 mm @±3 um | ||
| 2D Inspection Item | Missing Component,Wrong Component,Mis-Alignment,Skewed Component,Polarity,Tombstone,Solder Bridge,Flipped Device,Solder Ball,Etc | ||
| 3D Inspection ltem | Component Height,Position,Lifted Package,Lifted Lead,Solder Fillet,Excessive Solder,Insufficient Solder,Solder Bridge,Open Solder,Etc | ||
| Additional Specifications | |||
| Lens Configuration | Precision Telecentric Compound Lens Design | ||
| Lighting System | Eight Phase Color Lighting | ||
| SIDE-VIEWERO Camera System | Quantity Four-10MP Color Side-Angle Cameras Quantity Four -18MP CoaXPress Color Side-Angle Cameras |
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| PCB Surface Clearance | op-Side Clearance:45 mm /Bottom-Side Clearance:50 mm | ||
| PCB Edge Clearance | Top-Edge Clearance:3 mm /Bottom-Edge Clearance:3.5 mm | ||
| Maximum PCB Warpage | ±2 mm | ||
| Maximum PCB Weight | Standard:4 Kg(8.82 Lbs.) | ||
| PCB Thickness Range | Standard:0.5mm -3mm /Optional:0.5 mm -5mm | ||
| Minimum Component Inspection | 0402 Chip(mm)101005 Chip (in)/0.3 Pitch (mm) | ||
| Robot Positioning System | Precision Closed Loop AC Servo Drive,Resolution:1 um /Repeatability:±10 um | ||
| Power Requirements | Single Phase 200~240V 50~60Hz;1.1 KW,Breaker Capacity:25 Amp | ||
| Air Requirements | 5 Kgf /cm²(0.5 Mpa);(71 PSI) | ||
| Machine Dimensions and Weight | |||
| MV-7 OMNI | 1,100 mm Wx1,500 mm Dx1,500 mm H (43.3"x59"x59") | 1,000 Kg(2,204 Ibs.) | |
| MV-7U OMNI | 1,270 mm Wx1,680 mm Dx1,500 mm H (50"x66.14"x59") | 1,200 Kg(2,645 Ibs.) | |
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