| Customization: | Available |
|---|---|
| Condition: | New |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
FUJI NXT-H SMT Pick And Place Machine
Hybrid Placing Machine
This machine is based on the surface mount technology for placing SMD parts in high speed and incorporates semi-conductor technology for placing die parts with high accuracy. The NXT-H allows you to go form a batch process using dedicated machines to an innovative inline production process.
Supports panels up to 610 x 610 mm
For small power modules and sensor modules
Handles dies up to 24 x 24 mm
For complex modules such as communication and sensor modules
Features
1. Hybrid placement of wafers and SMDs
Wafer, tray part, and reel part placement in a single unit. Supports production mainly using feeder parts, or mainly using wafers and trays by exchanging units.
2. High accuracy placement
High rigidity construction with linear motor movement and high resolution cameras. Combines the optimum placing pressure, high accuracy and high quality using advanced control technology.
3. A HEPA filter provides a cleanroom class of 1000
With the assumption that this machine is going to be used in cleanrooms, the XY robot is cleanroom capable. By setting a HEPA filter, you can get an even better environment for semiconductors.
4. Easy Operation
Equipped with a large 15 inch touchscreen panel and graphical interface. United interface controls both machine and MWU12i operation. Covers both wafer map data management and format conversion. *Individual user formats can be supported separately.
| Specifications | type FC | type SD | type LD | |||
| Heads | G04FQ | H24S/H24G | H08MQ | |||
| Die | Placement accuracy" | ±0.008 mm | ±0.020 mm | ±0.015 mm | ||
| Die size2 | 0.5x0.5 to 15x15 mm | 0.5x0.5 to 5.0x5.0 mm | 0.5x0.5 to 24x24 mm | |||
| Die thickness | 0.08 to 6.5 mm | 0.08 to 3 mm | 0.08 to 6.5 mm | |||
| Minimum bump size | 0.050 mm | |||||
| Bump pitch | 0.100 mm | |||||
| Throughput* | NXT-H | Face-up | 4,500 cph | 13,400 cph | 8,700 cph | |
| Face-down | 6,100 cph | |||||
| 4,000 cph | ||||||
| Wafer size | 4 to 12 inch | |||||
| Wafer magazine | 25 or 13 slots | |||||
| SMD | Placement accuracy | 0.008 mm | ±0.020 mm | ±0.015 mm | ||
| Part sizes | 0402(01005)to 15x15 mm | 0.2x0.2 to 5.0x5.0 mm | 0603 (0201)to 24x24 mm | |||
| Throughput* | NXT-H | 5,200 cph | 26,300 cph | 11,500 cph | ||
| Panel sizes (L*W) | NXT-H | 48x48 to 610x380 mm | ||||
| NXT-Hw | 48x48 to 610x610 mm | |||||
| Power | 3-phase AC200 to 230V±10%(50/60 Hz) | |||||
| Air | 0.5 MPa(ANR) | |||||
| Air consumption | 20 Lmin (ANR) | |||||
| Weight | NXT-H+MWU12i | 1,930 kg* | 1,910 kg | 1,910 kg | ||
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