Customization: | Available |
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Condition: | New and Used |
Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
The all new MV-9 SiP HYBRID 3D AOI system combines MIRTEC's exclusive OMNI-VISION® 3D Inspection Technology with a High-Resolution Laser System for precision 3D Inspection of System-InPackage (SiP) applications. This powerful new system is configured with MIRTEC's exclusive 25 Mega Pixel CoaXPress Camera and 12 Projection Digital TriFrequency Moiré 3D Technology. MIRTEC's 25 Mega Pixel CoaXPress Camera is a proprietary Industrial Camera designed and manufactured by MIRTEC for use with the complete product range of inspection equipment. MIRTEC's Digital Tri-Frequency Technology provides FULL 3D PCB inspection using a total of 12 Projected 3D Frequencies for precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.
Feature:
Model | MV-9 | |||||
Type Code | MV-9_M_OMNI_T_SL | MV-9_L_OMNI_T_SL | MV-9_M_OMNI_T_DL | MV-9_XXL_OMNI_T_DL_DH | ||
Max PCB Size Range | ||||||
In-Line AOI | 50x50~510x460mm | 60x60~660x610mm | 50x50~330x250mm | 50x50~330x250mm | ||
OMNI-VISION°3D/2D Inspection Technology | ||||||
3D Inspection Technology | Digitale 12 Projection Moiré Technologie | |||||
Height Accuracy | ±3 μm | |||||
2D Maximum Inspection Speed | ||||||
25 Megapixel Camera | CoaXPress | 7.7 μm | 4,593mm²/Sec | |||
15 Megapixel Camera | CoaXPress | 10 μm | 5,080mm²/Sec | |||
15 μm | 10,716mm²/Sec | |||||
3D/2D Maximum Inspection Speed | ||||||
25 Megapixel Camera | CoaXPress | 7.7 μm | 1,460mm²/Sec | |||
15 Megapixel Camera | CoaXPress | 10 μm | 1,890mm²/Sec | |||
15 μm | 4,260mm²/Sec | |||||
System Specification | ||||||
Lighting System | 8 Phasen Coaxial Color Lighting System | |||||
Side ViewerCamera System | Option | 18/10 Megapixel Digital Color Side [4ea] | ||||
PCB Top Side Clearance | 45mm | |||||
PCB Bottom Side Clearance | Standard | 25mm | ||||
Option1 | 50mm [Min.PCB Size Range 60x60 mm] | N/A | ||||
Option2 | 70mm [Ultrasonic Sensor] | N/A | ||||
PCB Thickness | 0.5mm~3mm | |||||
Maximum PCB Weight | 4kg | |||||
Software | Standard | Built-in SPC,Built-in Repair,RDS | ||||
Option1 | RRS,IRS,OLTT,ePM-AOI | |||||
Minimum Component Inspection |
25 Megapixel Camera | 7.7 μm | 03015 Chip [mm]/0.3 Pitch [mm] | |||
15 Megapixel Camera | 10 μm | 03015 Chip [mm]/0.3 Pitch [mm] | ||||
15 μm | 0603 Chip [mm]/0201 Chip [mm]/0.4 Pitch [mm] | |||||
Robot Positioning System | X/Y Axis | Linear Drive Motor System | Ball Screw Motor System | |||
Power Requirements | Single Phase[s]200~240V 50~60Hz,1.1 KW |
Single Phase[s]200~240V 50~60Hz,1.1 KW |
Single Phase[s]200~240V 50~60Hz,1.5 KW |
Single Phase[s]200~240V 50~6OHz,2.2 KW |
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Air Requirements | 5 Kgf /cm²[0.5 MPa] | |||||
Dimension and Weight | ||||||
Dimension [mm] | Machine | 1,250[W]×1,500[D]×1,600[H] | 1,400[W]x1,650[D]x1,600[H] | 1,250[W]x1,500[D]x1,600[H] | 1,316[W]x1,803[D]x1,670[H] | |
Width [Machine G Conveyor] |
1,700 | 2,150 | 1,280 | 1,476 | ||
Weight | Approx.1,200 kg | Approx.1,500 kg | Approx.1,400 kg | Approx.1,500 kg |