| Customization: | Available |
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| Condition: | New and Used |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
The Mirtec MS-11e is a high-performance Inline Solder Paste Inspection (SPI) system designed to deliver precise and reliable inspection of solder paste deposits. Ideal for electronics manufacturers who demand accuracy and efficiency, the MS-11e ensures consistent quality control throughout the production process.
Feature:
| Model | MS-11e | ||
| PCB Inspection Area | |||
| MS-11e | 50 mm x50 mm to 510 mm x460 mm (2.0"x2.0"to 20.1"x18.1") | ||
| MS-11e(Extended PCB Size) | 50 mm x50 mm to 510 mm x510 mm (2.0"×2.0"to 20.1"×20.1") | ||
| MS-11DL(Dual Lane) | Single Lane:50 mm x50 mm to 460 mm x590 mm (2.0"×2.0"to 20.1"x23.23") Dual Lane:50 mm x50 mm to 460 mm x300 mm (2.0"×2.0"to 20.1"x11.81") |
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| MS-11em (Small-Footprint) | 50 mm x50 mm to 330 mm×280 mm (2.0"×2.0"to 12.99"×11.02") | ||
| Vision System (FOV Size) | |||
| 4MP CameraLink:(2,048×2,048@180 fps) | Option 1 | Pixel Resolution:15 um | 32.17 mm x32.17 mm(1.27"x1.27") |
| Option 2 | Pixel Resolution:10 um | 24.13 mmx24.13 mm (0.95"x 0.95") | |
| 15MP CoaXPress:(3,904×3,904 @120 fps) | Option 1 | Pixel Resolution:15 um | 58.56 mm x58.56 mm (2.31"×2.31") |
| Option 2 | Pixel Resolution:10 um | 39.04 mm x39.04 mm(1.54"x1.54") | |
| 25MP CoaXPress:(5,120×5,120 @72 fps) | Option 1 | Pixel Resolution:7.7 um | 39.42 mm x39.42 mm (1.55"x1.55") |
| Inspection Technology | |||
| 3D Inspection Technology | Dual Projection Shadow Free Moiré Phase Step Image Processing | ||
| 2D Inspection Technology | 4MP CameraLink/15MP CoaXPress /25MP CoaXPress Camera System | ||
| Height Resolution | ±1 um | ||
| Height Accuracy on Calibration Fixture | ±1% | ||
| Repeatability on Calibration Fixture | Height:±1%/Volume:±2% | ||
| Inspection Height | Maximum:500 um /Minimum:40um | ||
| 3D Inspection Item | Solder Deposition:Height,Volume /Area,Solder Bridge,X/Y Offset,Shape Deformity,etc. | ||
| Additional Specifications | |||
| Lens Configuration | Precision Telecentric Compound Lens Design | ||
| Lighting System | Advanced High-Intensity RGB LED Lighting System. | ||
| PCB Surface Clearance | Top-Side Clearance:20 mm /Bottom-Side Clearance:50 mm | ||
| PCB Edge Clearance | Top-Edge Clearance:3 mm /Bottom-Edge Clearance:3.5 mm | ||
| Maximum PCB Warpage | ±2 mm | ||
| Maximum PCB Weight | Standard:4 Kg (8.82 Lbs.) | ||
| PCB Thickness Range | Standard:0.5 mm-5 mm | ||
| Robot Positioning System | Precision Closed Loop AC Servo Drive,Resolution:1 um /Repeatability:±10 um | ||
| Power Requirements | Single Phase 200~240V 50~60Hz;1.1 KW,Breaker Capacity:25 Amp | ||
| Air Requirements | 5 Kgf /cm²(0.5 Mpa);(71 PSI) | ||
| Machine Dimensions and Weight | |||
| MS-11e | 1,080 mmWx1,470 mm Dx1,500 mm H (42.5"×57.87"×59.1") | 950 Kg(2,094 Ibs.) | |
| MS-11DL | 1,080 mm Lx1,610 mm Wx1,610 mm H (42.5"×63.39"×63.39") | 1.030 Kg (2,270.76 Ibs) | |
| MS-11em | 900 mm Lx1,290 mm Wx1,660 mm H(35.43"×50.79"x65.35") | 870 Kg (1,918.02 Ibs) | |
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