| Customization: | Available |
|---|---|
| Condition: | Used |
| Speed: | High Speed |
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Meraif is the leading SMT factory solution provider in China,offering professional SMT factory building advice and service.
We have 18 year experience about SMT factories,offering full solutions for global clients with our great advantaged sources.
All SMT machines and SMT spare parts for PCBA assembly we can support you ,SMT pick and place machines,SMT Solder Paste Printers, Reflow Oven, Wave Soldering Machines,3D AOI,3D SPI,PCB Cleaning Machines,PCB Cutting Machines.
Our core technology team members are well experienced in SMT filed, One-stop SMT Solution for PCBA factory Through Asian supply chain output, Meraif support customers build factories including technical evaluation, equipment provision, workshop planning, technical support .
Saki's BF-3Si is one of the world's fastest 2-projector solder paste inspection systems while Saki's Phase Measurement Profilometry with Liquid Crystal on Silicon (LCoS) technology ensures high repeatability of inspection results. Saki's 3D SPI system inspects for: Height, volume, area, bridging, offset, shape.
Solder paste inspection combines full-color 2D and 3D images and is based on 3D data. The condition of the solder paste is measured and automatically judged in 3D for each pad using Saki's proprietary height measurement technology, Phase Measurement Profilometry with LCoS. Saki's active projection technology projects various lighting patterns to measure all items on a substrate with a height range of 0-500 microns. By switching projection patterns at high speed, in real time, and combining both a narrow and wide range of measurement, Saki's BF-3Si realizes broad dynamic ranges.
Saki 's unique, state-of the-art 3D measurement technology provides advanced analysis capability, with easy and powerful image-viewing features that allow the user to rotate, enlarge, and reduce images. The system automatically measures warpage at various points across a broad area of the board and optimizes the settings based on the warpage and the printed solder paste thickness to provide the greatest accuracy in warpage measurement and compensation. Program generation is via CAD data. Saki's BF-3Si SPI system also features a high-rigidity gantry for a very solid, accurate, and reliable, high-speed imaging system.
Some Process Errors
'The spread of the solder ' that causes a short circuit fault on the pad captures the operation error
Feature:
| Market | Asia | Global | |||||
| Dimensions | M Single lane |
M Dual lane |
L Single lane |
L Dual lane |
XL Single lane |
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| Model Name | 3Di-MS2 | 3Di-MD2 | 3Di-LS2 | 3Di-LD2 | 3Di-ZS2 | ||
| Size (W)×(D)×(H) (mm,in.) |
850×1430×1500, 33.46×56.30×59.06 |
1040×1440×1500, 40.94×56.69×59.06 |
1340×1440×1500 52.75×56.69×59.06 |
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| Weight | 850kg,1873.93Ib | 900kg,1984.16lb | |||||
| Electric Power | Single Phase~200-240V+/-10%,50/60Hz | ||||||
| Air Requirement | 0.5MPa,5L/min(ANR) | ||||||
| PCB Size (mm,in.) |
- | Single mode |
Dual mode |
- | Single mode |
Dual mode |
- |
| 50×60~330×330, 1.97×2.36~12.99×12.99 |
50×60~330×330, 1.97×2.36~12.99×12.99 |
50×60~320×330, 1.97×2.36~12.60×12.99 |
7μm camera head | 7μm camera head | 50×60~686×870, 1.97×2.36~27.00×34.25 |
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| 50×60~330×330, 1.97×2.36~12.99×12.99 |
50×60~330×330, 1.97×2.36~12.99×12.99 |
50×60~320×330, 1.97×2.36~12.60×12.99 |
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| 12/18μm camera head | 12/18μm camera head | ||||||
| 50×60~500×510, 1.97×2.36~19.68×20.07 |
50×60~500×510, 1.97×2.36~19.68×20.07 |
50×60~320×510, 1.97×2.36~12.60×20.07 |
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| PCB Clearance | Top:40mm,1.57in. Bottom:60mm,2.36in. |
Top:40mm,1.57in. Bottom:50mm,1.96in. |
Top:40mm,1.57in. Bottom:60mm,2.36in. |
Top:40mm,1.57in. Bottom:50mm,1.96in. |
Top:40mm,1.57in. Bottom:60mm,2.36in. |
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